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Ashok,
Looks like you answered your own question.
20 mil pad design - (2.5 mil etch x 2 sides) = 15 mil pad actual > 10
mils
Ben
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ashok Dhawan
Sent: Thursday, May 15, 2008 9:05 PM
To: [log in to unmask]
Subject: [TN] Solder Pad width
I am looking for measured pad width for 20 mil land pattern for SMT.
(QFP or TSOP)
What is Pad width actal versus top copper layer? Copper outer layer is
1 oz or 2 oz or 3 ozs.
Reason for this question: Stencil is 6mils thick with min aperture
opening of 9 mils. For gasketing, the pad need to o=be over 10 mils.
2 Ozs copper has etch factor 2.5 mils over etch each side. Can final pad
width of over 10 mils be made.
Any inputs on this will be appreciated.
Regards
Ashok
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