Make the most of your time at National Electronics Week. Stay up to date with in-depth technical seminars presented by
IPC - Association Connecting Electronics Industries.
Explore full course descriptions at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>.
Technical seminars will take place in a compelling location: Earls Court, Warwick Road, London.
Register now for technical seminars at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>. Take advantage of value pricing for this event: £175 for one full-day or two half-day seminars, £95 for one half-day seminar. Save 10% on registration with confirmation by 30 May 2008.
Technical Seminar Program at a Glance
Tuesday, 17 June
Achieving High Reliability for Lead-Free Solder Joints - Material Considerations
Ning-Cheng Lee, Ph.D., Indium Corporation of America
Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles
Happy Holden, Mentor Graphics
Surface Mount Technology: Principles & Practice in a Lead-Free World
Ray Prasad, Ray Prasad Consultancy Group
Updating Rework and Repair for Lead-Free
Berry Morris, ART Advanced Rework Technology
Lead-Free Reliability for Harsh Environment Electronics
Jennie Hwang, Ph.D., H-Technologies Group
Wednesday, 18 June
Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints
John Lau, Ph.D., Institute of Microelectronics
What is HDI? Do you Need HDI? How to Get Started
Happy Holden, Mentor Graphics
Lead-Free BGA Reliability in Packaging and Assembling
Jennie Hwang, Ph.D., H-Technologies Group
Ball Grid Array: Principles and Practice
Ray Prasad, Ray Prasad Consultancy Group
Thursday, 19 June
Stencil Printing Process for Solder Paste Application: An In-Depth Look
S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
Reliability Issues with Lead-Free Soldering Processes
Werner Engelmaier, Engelmaier Associates L.C.
True Design for Reliability: Understanding What Is and What Is Not DfR
Craig Hillman, Ph.D., DfR Solutions
Advanced Component Packages - An Introduction Including Lead-Free Implementation
S. Manian Rumkumar, Ph.D., Rochester Institute of Technology
Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs) Including Lead-Free Soldering Impact
Werner Engelmaier, Engelmaier Associates L.C.
Understanding Failure and Root-Cause Analysis in Lead-Free Electronics
Craig Hillman, Ph.D., DfR Solutions
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|