Make the most of your time at National Electronics Week. Stay up to date with in-depth technical seminars presented by IPC - Association Connecting Electronics Industries. Explore full course descriptions at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>. Technical seminars will take place in a compelling location: Earls Court, Warwick Road, London. Register now for technical seminars at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>. Take advantage of value pricing for this event: £175 for one full-day or two half-day seminars, £95 for one half-day seminar. Save 10% on registration with confirmation by 30 May 2008. Technical Seminar Program at a Glance Tuesday, 17 June Achieving High Reliability for Lead-Free Solder Joints - Material Considerations Ning-Cheng Lee, Ph.D., Indium Corporation of America Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles Happy Holden, Mentor Graphics Surface Mount Technology: Principles & Practice in a Lead-Free World Ray Prasad, Ray Prasad Consultancy Group Updating Rework and Repair for Lead-Free Berry Morris, ART Advanced Rework Technology Lead-Free Reliability for Harsh Environment Electronics Jennie Hwang, Ph.D., H-Technologies Group Wednesday, 18 June Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints John Lau, Ph.D., Institute of Microelectronics What is HDI? Do you Need HDI? How to Get Started Happy Holden, Mentor Graphics Lead-Free BGA Reliability in Packaging and Assembling Jennie Hwang, Ph.D., H-Technologies Group Ball Grid Array: Principles and Practice Ray Prasad, Ray Prasad Consultancy Group Thursday, 19 June Stencil Printing Process for Solder Paste Application: An In-Depth Look S. Manian Ramkumar, Ph.D., Rochester Institute of Technology Reliability Issues with Lead-Free Soldering Processes Werner Engelmaier, Engelmaier Associates L.C. True Design for Reliability: Understanding What Is and What Is Not DfR Craig Hillman, Ph.D., DfR Solutions Advanced Component Packages - An Introduction Including Lead-Free Implementation S. Manian Rumkumar, Ph.D., Rochester Institute of Technology Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs) Including Lead-Free Soldering Impact Werner Engelmaier, Engelmaier Associates L.C. Understanding Failure and Root-Cause Analysis in Lead-Free Electronics Craig Hillman, Ph.D., DfR Solutions --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------