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April 2008

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TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Wed, 2 Apr 2008 16:51:26 +0200
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Vacuum does not seem to be the best method always. We were in a similar
situation as you once. Instead of getting a voidfree joint, we got lots and
lots of big voids. Reason was the lowering of atmosphere pressure caused
some volatiles in the adhesive to start bubbling without our control. So,
seems as one got to know what 'vacuum' level to use.

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Brian Chandler
Skickat: den 2 april 2008 16:01
Till: [log in to unmask]
Ämne: [TN] Vacuum Assembly

Anyone have experience with using vacuum assembly to attach a flex circuit
to a concave surface using adhesive without voids? Any insight into this
process would be appreciated.

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