Vacuum does not seem to be the best method always. We were in a similar situation as you once. Instead of getting a voidfree joint, we got lots and lots of big voids. Reason was the lowering of atmosphere pressure caused some volatiles in the adhesive to start bubbling without our control. So, seems as one got to know what 'vacuum' level to use. Inge -----Ursprungligt meddelande----- Från: TechNet [mailto:[log in to unmask]] För Brian Chandler Skickat: den 2 april 2008 16:01 Till: [log in to unmask] Ämne: [TN] Vacuum Assembly Anyone have experience with using vacuum assembly to attach a flex circuit to a concave surface using adhesive without voids? Any insight into this process would be appreciated. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------