Scott

Flash, electrolytic gold has been used by Asian board houses for close to 
five years. Very positive papers have been given by OEMs at IPC on the 
solderability of this finish. In so far as I am aware, all of the evidence 
has been positive.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Scott Lefebvre" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 27, 2008 12:01 PM
Subject: [TN] Gold Flash vs. ENIG Solder finish


I have a FAB house that is recommending we switch from using ENIG for
the main body with electroplated hard gold for the edge fingers to an
alternate finish.  They are recommending Gold Flash *Finish the entire
board with 3-10 micro inches of hard Au over 100-200 micro-inches of Ni
and selectively Au plate fingers with 30-50 micro-inches of hard Au.
They reason they want us to change is it removes the step of removing
the tie-bars on the gold edge fingers.

Would this have an affect with solderability switching to Gold Flash?


Scott


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