Louis

I would continue the process as you are currently doing. You can never be 
too clean or too rich.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Louis Hart" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 21, 2008 10:20 AM
Subject: [TN] preparation for HASL


TechNetters, a question has come up in our plant about cleaning copper 
surfaces before HASL. (Solder used is the standard tin-lead.) We've been 
putting panels through a light acid clean and etch, then through a 
Quicksilver flux applicator with two rollers that appear to be saturated 
with Enthone 757 SG flux. Someone has asked if that acid clean and etch are 
really necessary, since what is flux supposed to do?

Any comments on the need for the acid clean and etch would be most welcome.

Many thanks - Louis

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272


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