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Yes you are right young David the only criteria for LGA/QFN is based on
inspection of the side terminations.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
Book your place on Bob's "Step by Step Failure Analysis Workshop" 14th
May www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: 05 March 2008 14:14
To: [log in to unmask]
Subject: Re: [TN] QFN Thermal Plane Voiding
Hi Vector! Where is the 25% requirement in A610? I did not find a
requirement listed for the thermal pad coverage.
Dave Hillman
Rockwell Collins
[log in to unmask]
Victor Hernandez <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/05/2008 07:49 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]
To
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cc
Subject
[TN] QFN Thermal Plane Voiding
Fellow TechNetters:
The 25% solder voiding has been an accepted rule of thumb for QFN, Quad
Flat w/No Leads, IPC-A-610D sec. 8.2.13. Is there any other guideline
out there.
Victor,
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