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Sun, 2 Mar 2008 08:47:07 -0500 |
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March 2, 2008
Folks, we have an OEM that purchased axial leaded diodes from On
Semiconductor. Since the diodes were not mil-spec parts, the OEM sent them
to a test house for qualification and electrical screening testing. The
screening is performed at 175C which I believe is the max storage temp of
the part. They also performed solderability testing which failed (<90%
wetting).
The OEM subsequently solder dipped the parts in Sn63 solder and was able to
solder them OK.
The part manufacturer indicated the solderability problem was most likely
caused by tin migration due to the testing at 175C.
Seems to me that since MIL-PRF-19500 includes electrical screening testing,
the parts should have been able to withstand the full screening testing with
no solderability failures since the parts most likely were made on the same
line and samp processing as mil spec parts.
Any info you can provide on tin migration or on the manuf position that the
solderability failure was the result of the testing at 175C would be
appreciated. Have other folks experienced solderability issues for matte
tin plated parts?
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