Inge,

I don't see any 1kV images and don't quite understand what you mean by
referring to a "strange superficial structure". 

Another point is the presence of F. The fact that the software shows it
DOES NOT mean it's there (and the actual spectrum you provided doesn't
tell it's there). 

Regards,

Vladimir


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Thursday, September 06, 2007 10:01 AM
To: [log in to unmask]
Subject: [TN] Semi guys, need support


 25 micron gold ball bonding bad yield, ball lifts, poor adhesion on Al
pads. Triple diff line tranceiver chip. Weird micrographic exteriour,
EDAX gives C,F,O, Cl,Cu,Al,Fe. Cu can be ppm alloy but the others
unwanted on semi chip bond pads I think. 1kV SEI SEM reveals strange
superficial structure. Chip not contaminated by us, fresh opened chip
trays show this face. Question: what semi manufacturing problem can this
be? Will post a few pics to Steve's gallery.

TrikeMan? 

/Inge

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