Hi Inge and Everyone!

I've got your pictures up. Go to:

http://stevezeva.homestead.com/files/RYT809205_25b.jpg

http://stevezeva.homestead.com/files/RYT809205_20b.jpg

http://stevezeva.homestead.com/files/RYT809205_4.jpg

http://stevezeva.homestead.com/files/RYT809205_9.jpg

http://stevezeva.homestead.com/files/Spectrum_RYT809205_flat.jpg

Sorry I can't help with any input, but this kind of stuff is w-a-a-a-y
out of my league...

Steve

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Thursday, September 06, 2007 9:01 AM
To: [log in to unmask]
Subject: [TN] Semi guys, need support

 25 micron gold ball bonding bad yield, ball lifts, poor adhesion on Al
pads. Triple diff line tranceiver chip. Weird micrographic exteriour,
EDAX gives C,F,O, Cl,Cu,Al,Fe. Cu can be ppm alloy but the others
unwanted on semi chip bond pads I think. 1kV SEI SEM reveals strange
superficial structure. Chip not contaminated by us, fresh opened chip
trays show this face. Question: what semi manufacturing problem can this
be? Will post a few pics to Steve's gallery.

TrikeMan? 

/Inge

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