Hi,
I'm trying to revamp some of the spacing requirements that our
Manufacturing Dept. has decided upon and need some documented proof that
the spacing they "require" is unnecessary.  I tried to find specific
requirements in IPC-2221, but wasn't able to find them.  What I'd like to
find is spacing requirements for pad-to-pad, pad-to-trace, smd land-to smd
land.  I'd like to find requirements for solder wave and reflow processes.
Does anyone know what IPC spec I should be looking at?  Or a reliable
reference I can find?  These requirements would only take Manufacturing
rules into consideration, disregarding any electrical rules.
Thanks for any help you can be,
Kitty

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