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August 2007

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Subject:
From:
Andre Demers <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 28 Aug 2007 16:01:17 -0400
Content-Type:
text/plain
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text/plain (85 lines)
Hi Kitty,

If I understood your question, then the best source would be your fab
house.
They can give all their minimum requirements in order to fabricate your
board,
and you decide if you can or can't meet them based on electrical
requirements,
board density etc .... Basically designing for fab.

Let me know if I'm off base on this.

Regards,


Andre Demers, C.I.D.
Senior PCB Designer, Coordinator

cmrsummit Technologies
329 March Road, Suite 203
Kanata ON K2K 2E1
Canada

Telephone: 613.599.3881
Toll Free: 877.428.1229
Pager: 613.368.0506 
Fax: 613.599.7889 

[log in to unmask] <mailto:[log in to unmask]> 
www.cmrsummit.com <http://www.cmrsummit.com/> 



 

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Kitty Hines
Sent: Tuesday, August 28, 2007 2:53 PM
To: [log in to unmask]
Subject: [DC] Spacing Requirements

Hi,
I'm trying to revamp some of the spacing requirements that our
Manufacturing Dept. has decided upon and need some documented proof that
the spacing they "require" is unnecessary.  I tried to find specific
requirements in IPC-2221, but wasn't able to find them.  What I'd like
to
find is spacing requirements for pad-to-pad, pad-to-trace, smd land-to
smd
land.  I'd like to find requirements for solder wave and reflow
processes.
Does anyone know what IPC spec I should be looking at?  Or a reliable
reference I can find?  These requirements would only take Manufacturing
rules into consideration, disregarding any electrical rules.
Thanks for any help you can be,
Kitty

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