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Graham
I don't know if I understood your question righ, but they must melt together, otherwise you would have to heat the solder joint to 327°C to melt the lead. Are there tin- lead phases and lead tin phases with gaps in between or is the surface of the joint uneven?
Best regards
Guenter
_____________________________________________________
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 44 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
_____________________________________________________
>>> Graham Naisbitt <[log in to unmask]> 08/15/07 12:24 pm >>>
Techies
Apropos the earlier exchange, take a look at this link: http://
news.bbc.co.uk/1/hi/technology/6946042.stm
Maybe all will be well with the XBox in 2011?
How about this curious problem: I have a client suffering from an
apparent refusal of the tin and lead to meld together in his process
but on on 1 to 10 individual joints per assembly. It looks like a
cold joint (stay off this Dewey!) yet the joint is hard but separated
metals - anyone got any clues? Pretty much every conceivable test has
been run without a solution.
What could prevent tin and lead melding - Mr Hillman or Mr Pauls?
Kindest regards
Graham Naisbitt
[log in to unmask]
www.gen3systems.com
Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121
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