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-----Original Message-----

From: John Burke <[log in to unmask]>



Date:         Thu, 26 Jul 2007 15:09:02 

To:[log in to unmask]

Subject: Re: [TN] microBGA rework





This may seem a little obvious, but I always do that profiling by drilling

into the component using a dental drill.



While writing, I have noticed a number of people having problems with lead

free on 0201 components. I put this down to the higher temperature running

out the flux activity due to the tiny amount of solder paste. Obviously

nitrogen would help with this but was just wondering if anyone else was

seeing issues, as I have also seen issues with a 0.5 MM BGA device.



Anyone out there have any comments??



John



 

 

John Burke

 

(408) 515 4992

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel

Sent: Thursday, July 26, 2007 2:22 PM

To: [log in to unmask]

Subject: [TN] microBGA rework



Hello gurus of the Technet,



 



 



We are trying to rework some microBGAs but there is not enough room under

the parts for a thermocouple and drilling a hole through the board is not an

option at this point.  



 



We are placing a thermocouple on the top of the components being reworked

and covering it with Kapton tape and the thermal profile we are using is

maxing-out at 215° C.



 



 



Does anyone have experience measuring the component temperature and not the

solder temperature and would they mind sharing their results?  Are we asking

for field defects because we are not measuring the solder temperature?



 



 



Thank you in advance,



 



David Tremmel



(847) 858-5540 - Cell



 





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Search the archives of previous posts at: http://listserv.ipc.org/archives

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815

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