Hello gurus of the Technet,

 

 

We are trying to rework some microBGAs but there is not enough room under
the parts for a thermocouple and drilling a hole through the board is not an
option at this point.  

 

We are placing a thermocouple on the top of the components being reworked
and covering it with Kapton tape and the thermal profile we are using is
maxing-out at 215° C.

 

 

Does anyone have experience measuring the component temperature and not the
solder temperature and would they mind sharing their results?  Are we asking
for field defects because we are not measuring the solder temperature?

 

 

Thank you in advance,

 

David Tremmel

(847) 858-5540 - Cell

 


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