Hi Ernesto,
Your suspicions are right on the mark.
If you have one SnPb and one LF reflow oven setting recipeāa one size fits
all, as you call it, you wind up overheating many of your assemblies with only
small components [I am assuming the resulting reflow profiles are adequately
high to provide good wetting on all SJs even of large components]. However, it
is much more llikely, that your oven setting recipes are not high enough for
the larger thermal ass components to assure consistent properly wetted solder
joints.
Werner
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