Hi Ernesto, Your suspicions are right on the mark. If you have one SnPb and one LF reflow oven setting recipeāa one size fits all, as you call it, you wind up overheating many of your assemblies with only small components [I am assuming the resulting reflow profiles are adequately high to provide good wetting on all SJs even of large components]. However, it is much more llikely, that your oven setting recipes are not high enough for the larger thermal ass components to assure consistent properly wetted solder joints. Werner ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------