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May 2007

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Subject:
IPC International Conference on Flexible Circuits, June 12 & 13, 2007, in Minneapolis, MN
From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Tue, 22 May 2007 10:41:24 -0500
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IPC International Conference on Flexible Circuits
June 12 & 13, 2007	
Minneapolis, MN

Join IPC to learn what is at the forefront of flexible circuitry:  new
manufacturing technologies, test strategies and applications.  This is
your opportunity to learn about the new developments in flex technology.

* Flexible Circuit Design Principles and Practices: Applications,
Fabrication Methodology, Design Guidelines and Lead Free Assembly
Process for SMT Technology - Vern Soberg, Tessera, Inc. 
* Key Aspects of Desmear, Metallization and Electroplating of Flexible
Circuits, Michael Carano, Electrochemical, Inc.
* Flex Circuit Fundamentals, Ken Gilleo, Ph.D., ET-Trends LLC
* Flex Circuitry Applications - from Inner to Outer Space and in
Between, Ken Gilleo, Ph.D., ET-Trends LLC 

At our premier technical conference on June, 13th, the following
subjects will be addressed:

* Circuitry: Combining Application and Imagination
* How to Design with Flex in Mind
* Minimally Dimensioned Drawing
* Advanced Metallization Technologies for Continuous Processing of
Flexible Printed Circuits (FPC)
* Catalytic Ink Printing: The REAL Printed Circuit
* Fundamental Characteristics and Applications of Liquid Crystal Polymer
Flex
* Flex Based 3D Package-on-Package Solution for Next
* Generation Cameras
* Flexible Circuits Specifications Addressing CSP and High End Use
Applications

For more information or to register, please cut and paste
www.ipc.org/Flex into your browser and download the registration form.

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