IPC International Conference on Flexible Circuits June 12 & 13, 2007 Minneapolis, MN Join IPC to learn what is at the forefront of flexible circuitry: new manufacturing technologies, test strategies and applications. This is your opportunity to learn about the new developments in flex technology. * Flexible Circuit Design Principles and Practices: Applications, Fabrication Methodology, Design Guidelines and Lead Free Assembly Process for SMT Technology - Vern Soberg, Tessera, Inc. * Key Aspects of Desmear, Metallization and Electroplating of Flexible Circuits, Michael Carano, Electrochemical, Inc. * Flex Circuit Fundamentals, Ken Gilleo, Ph.D., ET-Trends LLC * Flex Circuitry Applications - from Inner to Outer Space and in Between, Ken Gilleo, Ph.D., ET-Trends LLC At our premier technical conference on June, 13th, the following subjects will be addressed: * Circuitry: Combining Application and Imagination * How to Design with Flex in Mind * Minimally Dimensioned Drawing * Advanced Metallization Technologies for Continuous Processing of Flexible Printed Circuits (FPC) * Catalytic Ink Printing: The REAL Printed Circuit * Fundamental Characteristics and Applications of Liquid Crystal Polymer Flex * Flex Based 3D Package-on-Package Solution for Next * Generation Cameras * Flexible Circuits Specifications Addressing CSP and High End Use Applications For more information or to register, please cut and paste www.ipc.org/Flex into your browser and download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------