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May 2007

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Subject:
Changing BGA solderballs from SAC405 to SAC105
From:
Phillip Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phillip Bavaro <[log in to unmask]>
Date:
Wed, 16 May 2007 17:30:59 -0700
Content-Type:
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I haven't been following the transition to use SAC105 so I would appreciate 
any advice those of you who have already gone down this path might have.

SAC405 and SAC305 was considered compatible with our SAC305 paste, but now 
there is a component which is changing the solderballs to SAC105.

SAC105 has a higher liquidus temperature (226 C) than SAC305 (217 C) .

Is this going to impact our assembly processes?

Does it only tighten up the reflow process window?

Is this transition something that the majority of manufacturers of 
components are going to undertake soon?

Thanks in advance,

Phil

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