I haven't been following the transition to use SAC105 so I would appreciate any advice those of you who have already gone down this path might have. SAC405 and SAC305 was considered compatible with our SAC305 paste, but now there is a component which is changing the solderballs to SAC105. SAC105 has a higher liquidus temperature (226 C) than SAC305 (217 C) . Is this going to impact our assembly processes? Does it only tighten up the reflow process window? Is this transition something that the majority of manufacturers of components are going to undertake soon? Thanks in advance, Phil --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------