Has anyone heard if IPC-D33D been released by IPC?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(AZ75)
Sent: Monday, July 26, 2004 12:35 PM
To: [log in to unmask]
Subject: Re: [TN] conductive via fill drill drawing note
IPC-D33D Plugged Via Task Group has been meeting for several years now.
There are many different ways to plug, fill or tent a via. Many are
end-use
specific or process driven. The results of these efforts will be
included
in IPC-6012 under design and performance requirements.
You should contact Don Dupriest or John Perry for more specifics.
Dewey
-----Original Message-----
From: Valerie St.Cyr [mailto:[log in to unmask]]
Sent: Monday, July 26, 2004 9:44 AM
To: [log in to unmask]
Subject: Re: [TN] conductive via fill drill drawing note
Michael,
I don't think that the IPC task group has yet released a specification
on
filled vias; the draft is in process.
We do not find any advantage for conductive fill for this application;
the
non-conductive fills will cap and plate over as well as the conductives;
be a whole lot less expensive; and, since they are not as "thick", will
fill small, high aspect ratio holes "better" (better being less
voiding).
Conductive is usually specified as less than 6:1 aspect ratio fill
capable, while non-conductives are 10 to 14:1 (depends on which brand
and
who you ask).
We only specify 60% fill in our acceptance spec without going into
particulars about the largest size of any void and so forth.
We also specify that filled vias have the same plating thickness as
non-filled vias.
You will need to call out the filled vias as a separate hole size on
your
chart and give them a separate D-code in the database so that they can
be
extracted and worked on independent of all the other non-filled vias. We
have a simple note which says "See holes in hole schedule to be filled
with a (then we have 2 check boxes) conductive (or) non-conductive
material {the designer checks off the appropriate one}. Finished pad
planarity to be within +000/-.002" on outer layers. Filled holes to be
plated consistent with the surrounding surface finish."
We do not specify any particular brand or brands (maybe we should, but
we
haven't tested them all).
I would also appreciate anyone else's feedback on our approach.
Valerie
Michael Bonek <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/26/2004 11:59 AM
Please respond to "TechNet E-Mail Forum."; Please respond to Michael
Bonek
To: [log in to unmask]
cc:
Subject: [TN] conductive via fill drill drawing note
We want to fill our via's in smd land with conductive material so the
land
will be flat and no PPT will fall into the hole. I cannot find an IPC
specification that calls out a conductive via fill for a drill drawing
note. I know not to be too specific on the type of material to be used
and
that I do want it planerized and followed with subsequent plating
finish.
Is anybody aware of an IPC drill drawing specification or would like to
share how they specify this process on there drill drawing?
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