Has anyone heard if IPC-D33D been released by IPC? Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (AZ75) Sent: Monday, July 26, 2004 12:35 PM To: [log in to unmask] Subject: Re: [TN] conductive via fill drill drawing note IPC-D33D Plugged Via Task Group has been meeting for several years now. There are many different ways to plug, fill or tent a via. Many are end-use specific or process driven. The results of these efforts will be included in IPC-6012 under design and performance requirements. You should contact Don Dupriest or John Perry for more specifics. Dewey -----Original Message----- From: Valerie St.Cyr [mailto:[log in to unmask]] Sent: Monday, July 26, 2004 9:44 AM To: [log in to unmask] Subject: Re: [TN] conductive via fill drill drawing note Michael, I don't think that the IPC task group has yet released a specification on filled vias; the draft is in process. We do not find any advantage for conductive fill for this application; the non-conductive fills will cap and plate over as well as the conductives; be a whole lot less expensive; and, since they are not as "thick", will fill small, high aspect ratio holes "better" (better being less voiding). Conductive is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask). We only specify 60% fill in our acceptance spec without going into particulars about the largest size of any void and so forth. We also specify that filled vias have the same plating thickness as non-filled vias. You will need to call out the filled vias as a separate hole size on your chart and give them a separate D-code in the database so that they can be extracted and worked on independent of all the other non-filled vias. We have a simple note which says "See holes in hole schedule to be filled with a (then we have 2 check boxes) conductive (or) non-conductive material {the designer checks off the appropriate one}. Finished pad planarity to be within +000/-.002" on outer layers. Filled holes to be plated consistent with the surrounding surface finish." We do not specify any particular brand or brands (maybe we should, but we haven't tested them all). I would also appreciate anyone else's feedback on our approach. Valerie Michael Bonek <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 07/26/2004 11:59 AM Please respond to "TechNet E-Mail Forum."; Please respond to Michael Bonek To: [log in to unmask] cc: Subject: [TN] conductive via fill drill drawing note We want to fill our via's in smd land with conductive material so the land will be flat and no PPT will fall into the hole. I cannot find an IPC specification that calls out a conductive via fill for a drill drawing note. I know not to be too specific on the type of material to be used and that I do want it planerized and followed with subsequent plating finish. Is anybody aware of an IPC drill drawing specification or would like to share how they specify this process on there drill drawing? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------