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March 2007

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 29 Mar 2007 13:38:23 EDT
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Hello Pradeep
 
Sorry for the delayed response. No flow prepreg has been used with success  
for a good number of years. However, as you are noticing, no flow is not always 
 an accurate description of the material's actual performance . What you may  
wish to do is to increase the aperature in the prepreg slightly  in 
anticipation of the flow. There are no hard and fast rules as there  are many things 
that can effect flow, not all materials perform identically and  circuit designs 
will vary considerably thus altering the localized pressure and  squeeze out. 
You will likely need to do a bit of characterization of the  material(s) you 
use.  
 
As you infer, it is somewhat cosmetic (depending on use  and the nature of 
the bend.) The application of a  fillet of a low modulus epoxy or silicone to 
strain relieve the  transition from rigid to flex.
 
That aside, I have a quick are question, are you using vacuum  lamination?
 
Best wishes with your project, 
Joe



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