Hello Pradeep Sorry for the delayed response. No flow prepreg has been used with success for a good number of years. However, as you are noticing, no flow is not always an accurate description of the material's actual performance . What you may wish to do is to increase the aperature in the prepreg slightly in anticipation of the flow. There are no hard and fast rules as there are many things that can effect flow, not all materials perform identically and circuit designs will vary considerably thus altering the localized pressure and squeeze out. You will likely need to do a bit of characterization of the material(s) you use. As you infer, it is somewhat cosmetic (depending on use and the nature of the bend.) The application of a fillet of a low modulus epoxy or silicone to strain relieve the transition from rigid to flex. That aside, I have a quick are question, are you using vacuum lamination? Best wishes with your project, Joe ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------