The melting point of Tin is 232 degrees C.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Wednesday, March 28, 2007 11:58 AM
To: [log in to unmask]
Subject: Re: [TN] COMPATIBILITY

You are creating 2 solder joints:
1- Soldering to component leads:
	Assumption is that the component lead has Sn finish,
	- Sn has a high melting point above 250C, therefore it will not
reflow
	- The resultant will be a solder joint with SnCu4 intermetalic
2- Soldering to the PCB:
	Assumption is that the PCB has ENIG surface finish
	- Gold will dissipate in the solder
	- The resultant will be a solder joint with SnNi intermetalic

I am not aware of any concern with the above solder joints. Watch the
quality of the ENIG finish as it is less forgiving when used with lead
free assembly process at elevated reflow temperature.

Hope this helps,
Paymon Sani


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI
Sent: March 28, 2007 10:07 AM
To: [log in to unmask]
Subject: [TN] COMPATIBILITY

Hello all,

 

1.	Process: lead free (SAC 305) solder paste
2.	fine pitch component (QFP)termination finish: SN /NI/Pd/CU
3.	PCB pads: ENIG

 

Requesting every one to comment on the above combination. Will I have
any
major issues post reflow.?

 

 

Thanx

Badri

 

 

 








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