The melting point of Tin is 232 degrees C. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani Sent: Wednesday, March 28, 2007 11:58 AM To: [log in to unmask] Subject: Re: [TN] COMPATIBILITY You are creating 2 solder joints: 1- Soldering to component leads: Assumption is that the component lead has Sn finish, - Sn has a high melting point above 250C, therefore it will not reflow - The resultant will be a solder joint with SnCu4 intermetalic 2- Soldering to the PCB: Assumption is that the PCB has ENIG surface finish - Gold will dissipate in the solder - The resultant will be a solder joint with SnNi intermetalic I am not aware of any concern with the above solder joints. Watch the quality of the ENIG finish as it is less forgiving when used with lead free assembly process at elevated reflow temperature. Hope this helps, Paymon Sani -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI Sent: March 28, 2007 10:07 AM To: [log in to unmask] Subject: [TN] COMPATIBILITY Hello all, 1. Process: lead free (SAC 305) solder paste 2. fine pitch component (QFP)termination finish: SN /NI/Pd/CU 3. PCB pads: ENIG Requesting every one to comment on the above combination. Will I have any major issues post reflow.? Thanx Badri Disclaimer: =========== This E-mail may contain privileged information and is intended solely for the addressee. Any unauthorized use or dissemination of this message in whole or in part is strictly prohibited. If you have received this mail by mistake, please inform us immediately and delete this mail. Any information expressed in this mail does not necessarily reflect the views of Avalon Technologies (P) Ltd . 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Thank you! --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------