Hi Amol: When evaluating a new supplier or introducing a new product
design we will monitor critical plating thickness. Typically the
electroplated Cu thickness in the holes and Ni and Au min/max surface
thickness when applicable.
Regarding electroplated deposits, please remember depending on where you
take the reading on the board can make a huge difference due to current
density variations. So some common sense and an understanding of
electroplating must be used when selecting measurement sites.
We will do a simple run chart for a dedicated part number. These run
charts will have a reference line(s) for either minimum thickness,
maximum thickness or both.
We normally monitor on an as received basis for three months. During
that time if we are having problems we will contact the fabricator for
corrective action. Then continue to monitor for an additional three
months after the problem is resolved. This obviously can then go on and
on if plating problems keep cropping up, as it resets the three month
clock. Although we have found once they get the plating parameters
dialed in they stay pretty constant.
Since we are continually creating new designs/products we are if effect
continuously monitoring their plating processes with each new release.
You can escalate this up to control charts, statistical limits, standard
deviations, mean, XbarR, P, ad nauseam. Bottom line we are concerned
that the plating thickness meets our callout on the print. This is
normally a minimum plating thickness except were excessive electroplated
Au may be an issue. My advice is to keep it simple and understand what
is truly important to monitor.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Tuesday, March 13, 2007 4:18 AM
To: [log in to unmask]
Subject: [TN] PCB plating Qualification
Dear Members,
Is anybody out there looking at statistical data (control charts, Cp,
Cpk values) of plating thicknesses processes for say, ENIG and
evaluating your board house/s on it? Are there any procedures (IPC or
otherwise) for doing so? what matrices can be reasonably achieved for
plating processes? If this analysis is looked it, is it just a one time
deal or is this a recurrent activity (like every 6 months or 1 year or
some other time period)
Wanted to know the general trend in the industry.
Thanks in advance,
Amol
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