Hi Amol: When evaluating a new supplier or introducing a new product design we will monitor critical plating thickness. Typically the electroplated Cu thickness in the holes and Ni and Au min/max surface thickness when applicable. Regarding electroplated deposits, please remember depending on where you take the reading on the board can make a huge difference due to current density variations. So some common sense and an understanding of electroplating must be used when selecting measurement sites. We will do a simple run chart for a dedicated part number. These run charts will have a reference line(s) for either minimum thickness, maximum thickness or both. We normally monitor on an as received basis for three months. During that time if we are having problems we will contact the fabricator for corrective action. Then continue to monitor for an additional three months after the problem is resolved. This obviously can then go on and on if plating problems keep cropping up, as it resets the three month clock. Although we have found once they get the plating parameters dialed in they stay pretty constant. Since we are continually creating new designs/products we are if effect continuously monitoring their plating processes with each new release. You can escalate this up to control charts, statistical limits, standard deviations, mean, XbarR, P, ad nauseam. Bottom line we are concerned that the plating thickness meets our callout on the print. This is normally a minimum plating thickness except were excessive electroplated Au may be an issue. My advice is to keep it simple and understand what is truly important to monitor. Regards Michael Barmuta Staff Engineer Fluke Corp. Everett WA 425-446-6076 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349) Sent: Tuesday, March 13, 2007 4:18 AM To: [log in to unmask] Subject: [TN] PCB plating Qualification Dear Members, Is anybody out there looking at statistical data (control charts, Cp, Cpk values) of plating thicknesses processes for say, ENIG and evaluating your board house/s on it? Are there any procedures (IPC or otherwise) for doing so? what matrices can be reasonably achieved for plating processes? If this analysis is looked it, is it just a one time deal or is this a recurrent activity (like every 6 months or 1 year or some other time period) Wanted to know the general trend in the industry. Thanks in advance, Amol CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- This message (including any attachments) contains confidential and/or proprietary information intended only for the addressee. Any unauthorized disclosure, copying, distribution or reliance on the contents of this information is strictly prohibited and may constitute a violation of law. If you are not the intended recipient, please notify the sender immediately by responding to this e-mail, and delete the message from your system. If you have any questions about this e-mail please notify the sender immediately. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------