Dear Technetters,
 
Is XRF the best way to evaluate the condition of BGA packaging prior to
reflow?
 
I have an ALI chip which has gone EOL.  The customer is "testing" them,
but my yields are poor after reflow.  Due to the age and source of the
components, I suspect there may be damage to the Packaging and I'd like
to verify this prior to processing them.  
 
Whaddaya think?  
 
Is there a good way to review moisture content or damage to the
components.  Xray seems limited in its discrete ability to give me
condition of "softtissue" damage.   Anybody ever check weight before and
after baking or would inherent error be to great to reveal anything of
substance?
 
I look forward to your input,
 
Rodney L. Miller
Tri-onics Inc
Highland / Shanghai
 
Integrity and Solutions for Electronic Outsourcing
 

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