Dear Technetters, Is XRF the best way to evaluate the condition of BGA packaging prior to reflow? I have an ALI chip which has gone EOL. The customer is "testing" them, but my yields are poor after reflow. Due to the age and source of the components, I suspect there may be damage to the Packaging and I'd like to verify this prior to processing them. Whaddaya think? Is there a good way to review moisture content or damage to the components. Xray seems limited in its discrete ability to give me condition of "softtissue" damage. Anybody ever check weight before and after baking or would inherent error be to great to reveal anything of substance? I look forward to your input, Rodney L. Miller Tri-onics Inc Highland / Shanghai Integrity and Solutions for Electronic Outsourcing --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------