"is the PCB multi-layered, or is it double sided?"
  multilayered - that's an internal trace that you see.  I also have my doubts about the integrity of a via on that layer after delamination.

  The bubble and corner are greater than the 2.5mm defect spec in IPC, even though they aren't around any copper features on the same layer.  I was hoping they were repairable, but in many cases they have components directly above them on the other side of the board.  Is that an issue?

  How do you measure distances when they say .005" from copper feature - is it just X-Y distance, or do you consider Z as well?  Components on other side of board are within X-Y, but greater than that in the Z direction.


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