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November 2006

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Mon, 6 Nov 2006 11:12:15 -0600
Content-Type:
text/plain
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text/plain (69 lines)
Dan - We just executed a DOE for a conformal coating process on a
Pb-Free assembly. Factors among other things included 2 different
no-clean solder pastes and a Zestron product versus a traditional
alkanolamine saponifier. 
One of the responses that we measured was ionic cleanliness per the
Ionograph.  Assembly was double sided SM with limited through hole.
General results in ugm NaCl/in2 were as follows:

No Washing (flux residue still on)              68 - 122 
Saponifier                                      28 - 55
Zestron                                                 4 - 8 

The tighter distribution of data on the Zestron impressed me, but I
suspect that the Kyzan performance would have of been similar. 

                	
Rich K / GTS
847-621-7310
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan Mauro
Sent: Monday, November 06, 2006 10:56 AM
To: [log in to unmask]
Subject: [TN] Cleaning media for no clean paste

Folks,

 

I need to clean the residual residue left if any on boards processed
with no clean paste. 

What should one use.  Any thoughts - is there a common chemical cleaner
that can penetrate under components.

 

Thanks in Advance 

Dan  


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