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November 2006

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Subject:
From:
"Fox, Ian" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Fox, Ian
Date:
Wed, 29 Nov 2006 18:24:57 -0000
Content-Type:
text/plain
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text/plain (123 lines)
You should have seen that one coming Iain

Regards
Ian Fox
Goodrich ECS 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: 29 November 2006 14:46
To: [log in to unmask]
Subject: Re: [TN] Anti crack paste

Think I've started something here!!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Glidden
Sent: 29 November 2006 14:36
To: [log in to unmask]
Subject: Re: [TN] Anti crack paste


               *** WARNING ***

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     Keep this in mind if you answer this message. 

Oh no, can see where this one is going...as Whitney Houston would say
"crack is wack"


Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Wednesday, November 29, 2006 9:29 AM
To: [log in to unmask]
Subject: [TN] Anti crack paste

Hey all,

Anyone any experience with this relatively new solder paste from KOKI
(Japan); apparently it's an anti crack, no clean.
Its alloy composition is Sn96.5Ag3.0Cu0.5Ni0.05In0.5

        http://www.ko-ki.co.jp/product/pdf/S3XNI58-M650-3&N200K.pdf

I'm told it's expensive though I don't know what cost yet.

Regards,
        Iain.


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