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November 2006

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Mon, 27 Nov 2006 13:05:18 -0500
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I've never "stamped", but have seen a lot of product done that way.  We
call it "punched", since a big custom punch does the entire board edge
and unplated vias at the same time.

The perfect app for this technology is single sided mass produced
boards built on unre-enforced substrates.  Glass fibers tend to make
frayed edges and wear the punch faster.

Advantages:
Very cheap in production
Very repeatable board edge, with great registration to unplated holes

Disadvantages:
Expensive tooling costs
Lots of board stress--especially after punch wears

I'd keep multilayer traces pretty far away from the punch edge--how
far?  Depends on the thickness of the laminate and the kind of fibers in
the laminate.

Wayne Thayer


>>> [log in to unmask] 11/27/2006 12:13 pm >>>
Fellow TechNetters,

I have asked this question before and did not receive any responses so
I
will ask it again.

What are the Pro and Cons of stamping raw cards versus the traditional
router edge process?
There must be some guidelines out there for this process.

   Cons:   Frayed edges are susceptible to delamination.
   Cons.   Uncontrolled keep out zone for internal traces.

Victor,

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