George:
Isn't the trade off of avoiding the reballing for the
2 & 3 reasons not outweigh the risk of taking the other components to LF
profiles? I would say that if all the components are capable
withstanding that temp, it would definitely work. All the components
must be made to be processed in LF profiles. How about if the process is
using SnPb solder and to use SnPb profiles. Would you recommend to
reball? My apologies for all these questions. I am sure others would
like to hear also.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, November 27, 2006 9:00 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
There are three issues with re-balling BGA's:
1. It
Ramon,
There are three issues with re-balling BGA's:
1. It is expensive
2. You void the component manufacturers warranty 3. It is a solder
repair/replacement process that requires two heating operations(removal
and Replacement)
The reason we do not re-ball is because of 2 & 3. Anytime you do a
repair process you can introduce reliability issues and when it is
compounded by losing the warranty we decided not to reball
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Monday, November 27, 2006 8:47 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
Hi George:
" c). Do not re-ball Pb-Free area array packages
with SnPb balls."
Do you recommend not to reball SAC balls even if the solder
paste to be used is SnPb and Pb profiles? Could you expand the matter?
Thanks for your inputs.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Monday, November 27, 2006 4:57 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
Many thanks all for your responses, the team have come good again!
I guess I wasn't far off the mark then, looks like some discussions with
the Design Team are order of the day!
Regards,
Iain.
-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: 24 November 2006 15:49
To: TechNet E-Mail Forum; Braddock, Iain
Subject: RE: [TN] FW: [TN] BGA anomaly
Iain,
You've stated correctly the dilemma companies are facing. You've
comment/question about option 2 creating a reliability concern and also
invalidating the manufacturers warranty is also correct. Companies are
going to have to make their own risk assessments. Unfortunately, many
of those decisions are not knowledge based decisions because there isn't
good documented information available. The recommendations I've made
internally are:
1. Use SnPb assembly whenever possible
2. Use Pb-Free components and processes when product needs to be RoHS
6/6 compliant.
3. When forced into mixed alloy assembly:
a. For RoHS 6/6 product, use Pb-Free processes (245-260C) when
all components are compatible with Pb-Free processes.
b). For RoHS 5/6 product, use maximum SnPb process temperatures
(225- 235C) whenever there are components not compatible with
Pb-Free processes (i.e., don't exceed the maximum
temperature the MSL was tested at by the component vendor.
c). Do not re-ball Pb-Free area array packages with SnPb balls.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA /
Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell] -----Original
Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Friday, November 24, 2006 7:43 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
This sure is an interesting dilemma!
So which is the lesser of the two evils assuming you are forced into it
with the Design?
1) SnPb / SAC BGA's with a temperature profile (230ish)
that allows all joints to go liquidus.
2) Reball SAC BGA's with SnPb balls & use standard SnPb
thermal profile.
If option 2 does that not create reliability concerns also invalidate
the manufacturers warranty?
Regards,
Iain.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: 22 November 2006 17:39
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
*** WARNING ***
This mail has originated outside your organization, either from an
external partner or the Global Internet.
Keep this in mind if you answer this message.
Hi Ramon,
Mixing SnPb with SAC is not a very good idea--you are right.
Werner
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