November 20, 2006

My understanding is that one should not do this since some folks have test data that shows that SAC balls when re-flowed with SnPb solder will not always form a reliable solder joint.  For example, if you do accelerated life test, solder joints will fail at many fewer cycles that will a part with 90/10 tin-lead solder balls.  My recommendation is that you have accelerated life test done to determine if thewre is a concern in your spplication.
  ----- Original Message ----- 
  From: Braddock, Iain<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Monday, November 20, 2006 6:47 AM
  Subject: Re: [TN] BGA anomaly



  Not sure I worded this question so will ask again a slightly different way as I didn't get any responses.

  If one is reflow soldering ENIG boards with a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder what would be the preferred peak temp / time above?

  Regards,
  Iain.

  -----Original Message-----
  From: Braddock, Iain 
  Sent: 17 November 2006 08:35
  To: [log in to unmask]<mailto:[log in to unmask]>
  Subject: RE: [TN] BGA anomaly


  Joyce,

  I can't say it is preferable but how does one solder a board using SnPb solder with the odd PbF part whilst trying to ensure the profile will provide sufficient time above Solidus (Werner see I've learned!) to enable a satisfactory soldered joint?

  Regards,

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