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Date: | Mon, 20 Nov 2006 10:03:46 EST |
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Hi Iain,
Yes, there would be reliability concerns. not so much long-term, but
short-term, i.e. survival of the assembly processes.
Warping components/PCBs can prevent SJ formation [easy to detect]; fracture
SJs right on cooling from soldering T's [not easy to detect]; disturbed SJs, if
this happens on secondary heating from the other side [not easy to detect,
and a possible long-term latent reliability problem], ripping soldering pads
from the component/PCB resin matrix [this is not easy to detect unless it causes
atrace to be separated].
Werner
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