Right on!!! I agree totally.
Regards
Gaby,
Right on!!! I agree totally.
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer
Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent: Thursday, November 16, 2006 11:04 AM
To: [log in to unmask]
Subject: Re: [TN] Separation in BGA joints
IMHO the analysis of copper more than standard SAC may be caused by the
cross section preparation, smearing, etc.
Head in pillow it is and check the following:
http://alphametals.com/products/solder_solutions/pdf/pillowhead.pdf
Gaby
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 15, 2006 11:20 PM
Subject: Re: [TN] Separation in BGA joints
> Hi Vladimir,
> Certainly, more solder paste would have helped; but IMHO is is still
> the temperature being too low.
>
>
>
> Werner
>
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