Hi 'JaMi,'
While I agree with you about the appearance of these solder joints, I cannot
agree with you regarding what would happen in the absence of Au.
If you make the leads and their attachment area larger [which from electrical
and thermal conductivity considerations is advantageous], you run into
another problem.
For this type of devices, the lead material is typically Alloy 42, not Cu.
Thus, large soldered areas will suffer from local expansion mismatches in
combination with the global expansion mismatches.
In any case, the excessive amount of Au does not help.

Werner

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