Ramon - did you intend to post the commercial information at the start of your e-mail???
Anyway, thanks for the market information - do you mean Cookson supplied it from the three sources you listed?
Denny Fritz
MacDermid, Inc
-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Wed, 22 Nov 2006 9:07 AM
Subject: [TN] Silver Plating
FYI
Alpha STAR(r)
High Performance Immersion Silver for
Lead-Free Soldering
Consistent reliability in a lead-free circuit board finish just reached
a new level
Includes Alpha STAR Results on Planar Micro void
Issued / Revised: Aug 25, 2006
Surface Finishes Market Trends:
Projected Global Growth and Changes in the Market: HASL 57%, OSP 20%,
ENIG 14%, ImSn 3% and ImAg 6%
Projected to be: HASL 37%, OSP 28%,
ENIG 14%, ImSn 4% and ImAg 17%
CAGR 2004 Global Finish Volume 2008 Global Finish Volume Board Sqft CAGR
HASL -4.4% OSP 14.5% ImAg 42% ImSn 22% ENIG 5.7%
Source: Internal, Prismark, IPC/TMRC*Immersion Silver and OSP will grow
at the expense of HASL and ENIG
*HASL will decline due to the non-uniform planarity, poor cleanliness,
high layer count yield loss, Pb-free cost increase, lack of Pb-free
process development, and industry support
*ENIG high priced contact finish niche will continue, but "Black
Pad"fear, assembler liability issues, and costs pressures will lead to
decline*Immersion
Tin growth is less clear, press fit preferred, but limited by
inconsistent shelf life, long process time, tin whisker fear and solder
mask compatibility
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
________________________________________________________________________
Check out the new AOL. Most comprehensive set of free safety and security tools, free access to millions of high-quality videos from across the web, free AOL Mail and more.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|