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October 2006

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Subject:
From:
Graham Collins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 17 Oct 2006 15:18:54 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (217 lines)
Hi Inge
900 members, but some (like me) are sitting here scratching our heads
and thanking whomever we thank that we don't do wire bonding...
frankly, your problem is interesting but I've got no idea what could be
going on there.

So I will sit back and say "go Inge!!!"

 - Graham Collins

>>> [log in to unmask] 10/17/06 04:01PM >>>
Wattachallenge!
Crowds? Hmmm....puter says TN got about 900 members, but where are all?
In
reality, the 'crowd' seems to be maximum a handful or two. Yoda's
little
tribe, so as to say. The Yodaneers....he-he
Inge


----- Original Message -----
From: "John Burke" <[log in to unmask]>
To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'"
<[log in to unmask]>
Sent: Tuesday, October 17, 2006 8:02 PM
Subject: RE: [TN] ENIG problem


> And I hear the crowds shouting:
>
> "If anyone can section that Inge can".......................8-)
>
> Kind regards,
>
> John
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Monday, October 16, 2006 10:55 AM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG problem
>
> We will try to make a cross section. Maybe hard, because the
particles are
> VERY small.
> Inge
>
> ----- Original Message -----
> From: "Vladimir Igoshev" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, October 17, 2006 4:39 PM
> Subject: Re: [TN] ENIG problem
>
>
> Hi Inge,
>
> The surface looks awfully contaminated. Did you refer to those
"grayish"
> spot as "copper particles"? Do you happen to have a cross-sectioned
> image of the plating?
>
> Regards,
>
> Vladimir
>
> ATI Inc.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Tuesday, October 17, 2006 10:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG problem
>
> Mornin' Inge and Everybody!
>
> Got your picture up, it's here:
> http://stevezeva.homestead.com/files/ENIGpads.jpg
>
> Again another remarkable picture. Just curious about what is at the
top
> near the center and also on the right-hand edge? Looks like
something
> poking up and growing through the plating...what is that?
>
> -Steve Gregory-
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar
Hernefjord
> (KC/EMW)
> Sent: Tuesday, October 17, 2006 9:05 AM
> To: [log in to unmask]
> Subject: [TN] ENIG problem
>
>
> Hi amigos,
> I should never said that we had no ENIG problems. Now we seem to
have
> one. Chinese board supplier. Problems with heavy wire aluminum
bonding
> on the ENIG pads. Too low pull test values. Possible reason: pad
surface
> invaded by copper particles after the bake/reflow/mounting. Sending
> picture to Mr Yoda. Never seen this before. Gold is too thick for
being
> ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to
the
> surface so rapidly and at those low temperatures which are typical
for a
> general assembly process. Any clue? Graham? You seem to be sitting
at
> the keyboard just now.
> Ingemar Hernefjord
> SAAB MICROWAVE SYSTEMS
>
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