Our company has been making a Non RoHS
assembly for a couple of years. Now the requirement
is to have a  RoHS compliant assembly.

Current board is
18 layers - .072 thick ( lots of .002 and .003 cores)
6"x9"
4mil line, 4 mil space.
15,000 via holes, non conductive filler.

I talked to our fabricator and they recommend
laminate X.

The spec sheet from Manufacturer of Laminate X calls
out Tg at 210 C, and Td is 365 C. Based on the sheet
I would have thought the laminate would have survived
the reflow cycle.

Unpopulated, laminate X delaminated during
the reflow cycle at our Contract Manf site.
The Reflow  cycle looks ok to me.


Is there a IPC test method for delamination?

How many heat cycles should the board go through
for a Class 2 product?

Is there a qualified test lab that could do such testing?


Thanks in advance.

Dave

--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

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