This type of laminate "should" withstand a LF Assembly process - what is
the laminate type - some have an increases propensity for delamination
based on fabrication issues/processing difficulties.  The raw board
should withstand a series of testing IAW IPC-6012.  There is a great lab
called Robisan Labs in Indianapolis who are experts in doing these tests
and can give your results that can point you on the right root cause
direction.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Seymour
Sent: Monday, October 02, 2006 5:56 PM
To: [log in to unmask]
Subject: [TN] laminate Qualification

Our company has been making a Non RoHS
assembly for a couple of years. Now the requirement
is to have a  RoHS compliant assembly.

Current board is
18 layers - .072 thick ( lots of .002 and .003 cores)
6"x9"
4mil line, 4 mil space.
15,000 via holes, non conductive filler.

I talked to our fabricator and they recommend
laminate X.

The spec sheet from Manufacturer of Laminate X calls
out Tg at 210 C, and Td is 365 C. Based on the sheet
I would have thought the laminate would have survived
the reflow cycle.

Unpopulated, laminate X delaminated during
the reflow cycle at our Contract Manf site.
The Reflow  cycle looks ok to me.


Is there a IPC test method for delamination?

How many heat cycles should the board go through
for a Class 2 product?

Is there a qualified test lab that could do such testing?


Thanks in advance.

Dave

--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

[log in to unmask]

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