This type of laminate "should" withstand a LF Assembly process - what is the laminate type - some have an increases propensity for delamination based on fabrication issues/processing difficulties. The raw board should withstand a series of testing IAW IPC-6012. There is a great lab called Robisan Labs in Indianapolis who are experts in doing these tests and can give your results that can point you on the right root cause direction. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice - 802.257.4571 ext 21 Fax - 802.257.0011 <http://www.vtcircuits.com/> -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Seymour Sent: Monday, October 02, 2006 5:56 PM To: [log in to unmask] Subject: [TN] laminate Qualification Our company has been making a Non RoHS assembly for a couple of years. Now the requirement is to have a RoHS compliant assembly. Current board is 18 layers - .072 thick ( lots of .002 and .003 cores) 6"x9" 4mil line, 4 mil space. 15,000 via holes, non conductive filler. I talked to our fabricator and they recommend laminate X. The spec sheet from Manufacturer of Laminate X calls out Tg at 210 C, and Td is 365 C. Based on the sheet I would have thought the laminate would have survived the reflow cycle. Unpopulated, laminate X delaminated during the reflow cycle at our Contract Manf site. The Reflow cycle looks ok to me. Is there a IPC test method for delamination? How many heat cycles should the board go through for a Class 2 product? Is there a qualified test lab that could do such testing? Thanks in advance. Dave -- Dave Seymour, CID+ Catapult Communications Inc. 800 Perimeter Park Dr, Suite A Morrisville, NC 27560 Direct: (919)653-4249 Main: (919)653-4180 Fax: (919)653-4297 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------