Hi Arnaud,
Thank you for your interest. I shall put up the relevant information on the forum shortly as I will be at SMTA this week
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc.
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
Fax: (607) 687-9733
[log in to unmask]
www.harvardgrp.com
-----Original Message-----
From: arnaud grivon [mailto:[log in to unmask]]
Sent: Monday, September 25, 2006 10:59 AM
To: Kane, Amol (349)
Subject: [Fwd: Re: [LF] Copper Pad Peel Strength]
Importance: High
Hello Amol,
I keep interest in the thread you initiated on the TechNet forum dealing
with PCB pad peel-off in repair.
What I would like to know is what PCB base material is concerned and
what kind of BGA, as well as why the components needed to be repaired.
Could you share these information with me?
I thank you in advance.
Best regards,
Arnaud Grivon
-------- Message original --------
Sujet: Re: [LF] Copper Pad Peel Strength
Date: Wed, 30 Aug 2006 12:02:43 +0200
De: arnaud grivon <[log in to unmask]>
Pour: Kane, Amol (349) <[log in to unmask]>
Références:
<[log in to unmask]>
Amol,
Not sure if you got my request for additional information about your
problem, namely BGA and PCB type and PCB base material reference. Could
you provide these information?
Other questions by TechNet members are also of interest for the better
understanding of the phenomenon.
Best regards,
A. Grivon
Kane, Amol (349) a écrit :
> Dear Technetters,
> We are having instances where copper pads (Under BGAs) are being lifted off ENIG Boards almost too easily during rework. We use the same thermal profile on each board (for the same component removal) and only some show this phenomenon. Is there a test or standard to test the copper adhesion @ incoming to see whether it's the fab (i.e. are the boards coming to us with poor copper adhesion strength to being with) or the process that's doing this. The board is heated upto 120 C when the component is reflowed for removal. Also, is there data to show the decrease in Cu adhesion strength with temp?
>
> Thanks,
>
> Amol Kane
> M.S (Industrial Eng.)
> Process Engineer
> Harvard Custom Manufacturing, Inc.
> 941 Route 38 Owego, NY 13827
> Phone: (607) 687-7669 x349
> [log in to unmask]
> www.harvardgrp.com
>
>
>
>
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