Hi Arnaud, Thank you for your interest. I shall put up the relevant information on the forum shortly as I will be at SMTA this week Amol Kane M.S (Industrial Eng.) Process Engineer Harvard Custom Manufacturing, Inc. 941 Route 38 Owego, NY 13827 Phone: (607) 687-7669 x349 Fax: (607) 687-9733 [log in to unmask] www.harvardgrp.com -----Original Message----- From: arnaud grivon [mailto:[log in to unmask]] Sent: Monday, September 25, 2006 10:59 AM To: Kane, Amol (349) Subject: [Fwd: Re: [LF] Copper Pad Peel Strength] Importance: High Hello Amol, I keep interest in the thread you initiated on the TechNet forum dealing with PCB pad peel-off in repair. What I would like to know is what PCB base material is concerned and what kind of BGA, as well as why the components needed to be repaired. Could you share these information with me? I thank you in advance. Best regards, Arnaud Grivon -------- Message original -------- Sujet: Re: [LF] Copper Pad Peel Strength Date: Wed, 30 Aug 2006 12:02:43 +0200 De: arnaud grivon <[log in to unmask]> Pour: Kane, Amol (349) <[log in to unmask]> Références: <[log in to unmask]> Amol, Not sure if you got my request for additional information about your problem, namely BGA and PCB type and PCB base material reference. Could you provide these information? Other questions by TechNet members are also of interest for the better understanding of the phenomenon. Best regards, A. Grivon Kane, Amol (349) a écrit : > Dear Technetters, > We are having instances where copper pads (Under BGAs) are being lifted off ENIG Boards almost too easily during rework. We use the same thermal profile on each board (for the same component removal) and only some show this phenomenon. Is there a test or standard to test the copper adhesion @ incoming to see whether it's the fab (i.e. are the boards coming to us with poor copper adhesion strength to being with) or the process that's doing this. The board is heated upto 120 C when the component is reflowed for removal. Also, is there data to show the decrease in Cu adhesion strength with temp? > > Thanks, > > Amol Kane > M.S (Industrial Eng.) > Process Engineer > Harvard Custom Manufacturing, Inc. > 941 Route 38 Owego, NY 13827 > Phone: (607) 687-7669 x349 > [log in to unmask] > www.harvardgrp.com > > > > > CONFIDENTIALITY NOTICE: > This e-mail, and any attachments, is for the sole use of the intended > recipient(s) and may contain information that is confidential and > protected from disclosure under the law. Any unauthorized review, use, > disclosure, or distribution is prohibited. If you are not the intended > recipient, please contact the sender by reply e-mail, and delete/destroy > all copies of the original message and attachments. > Thank you. > > -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Leadfree > To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL) > Search previous postings at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ------------------------------------------------------------------------------- > CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------