The purpose of the D&P test method is to identify any partial/complete
fractures at Time Zero and/or at any sequence Rel Test or mfg. process.
We do this all the time and very normal.   What criteria will be
assigned to the partial fractures and how many is acceptable.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rudolph yu
Sent: Friday, September 15, 2006 1:22 PM
To: [log in to unmask]
Subject: [TN] Need help on a Dye & Pry test result

Recently I asked an outside lab to perform the dye & pry test on couple
failure assemblies. The heatsink was not removed from the PBGA prior to
the
dye application.

According to  the result and pictures,  the corner pads of the BGA
package
from both units were covered by the dye completely .  An indication that
a
seperation was formed between the BGA package's pads and its original
solder
balls at that one corner after the SMT process.

Have anyone of you experienced this kind of defects in the past and what
could be the root cause of this phenomena?  ( Poor plating from  the IC
manufacturer? SMT reflow profile? PCB warpage? )

I have been in the industry for 10 years and have never seen thing like
this.  Is it common??

Thanks
Ryu

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