Hi guys,

Can any one share your experience with the increase amount of dross
production from your lead-free wave operation?

I'm using SN100C alloy on an air atmosphere. I'm seeing 84% of the solder
used turning to dross (6.2:1 efficiency ratio).

In my study, I weighted the loaded board prior to and after wave solder to
determine the amount of solder on each PCBA, and compared the amount of
solder used to replenish the pot with the aggregate amount of solder
required on 15K units. The difference correlates with the amount of dross
produced.



I'd like to understand how much of this increase is attributed to the
lead-free technology and how much to the equipment performance.



Thanks for your help.



Miguel Vallejo

Mfr Engineer






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